Let Istar help you get started on your project with our experience and know-how!

Upload your design files and production requirements and we will get back to you within 30 minutes!

Semiconductor CNC Machining: Ultra-Pure Precision for Advanced Chip Manufacturing

Semiconductor CNC machining is the specialized process of creating ultra-precise parts for the chip manufacturing industry. At Istar Machining, we use advanced computer-controlled machines to make the critical components needed in semiconductor fabrication equipment.

These parts must meet extremely tight tolerances and be made from special materials that won’t contaminate the sensitive chip-making process. Our work helps make the microprocessors, memory chips, and sensors that power your everyday devices like phones and computers.

CNC Machining Parts

Get a New Quote

Supports uploading of the following file formats: .STEP .STP .SLDPRT .STL .IPT .3MF .3DXML .PRT .SAT .DXF .X_T .X_B .JT .CATPART

20+ Years

Istar Machining's years in the industry

300,000 square feet

The size of Istar Machining's factory

300 CNC machines

Our CNC equipment count

1000 skilled workers

Istar's number of skilled machinists/operators

Key Features of Our Semiconductor CNC Machining Services

Our precision CNC machining services for semiconductor applications offer:

  • Sub-micron precision (as small as ±0.001mm or 0.00004 inches)
  • Ultra-clean processing in ISO Class 7 cleanroom conditions
  • Specialized materials like silicon, germanium, and high-purity ceramics
  • Mirror-like surface finishes (Ra <0.2μm)
  • Industry compliance with SEMI S2/S8 and ISO 9001 standards
  • Quick turnaround options for prototype parts
  • Advanced machining using 5-axis CNC and EDM wire technology
  • Special coatings for plasma and chemical resistance

Materials We Machine for Semiconductor Applications

Material Type

Common Uses

Special Properties

Silicon & Germanium

Wafer carriers, test fixtures

Semiconductor-grade purity, brittle

Ceramics (AlN, Al₂O₃)

Plasma chambers, gas injectors

High temperature resistance, non-conductive

Stainless Steel 316L

Vacuum components, flanges

Ultra-clean, non-magnetic options

High-purity Plastics

Chemical delivery, wafer handlers

Particle-free, chemical resistant

Specialty Alloys

RF components, thermal parts

Low thermal expansion, high conductivity

Common Semiconductor Parts We Make

Our CNC machining service creates many critical semiconductor components:

  1. Wafer Handling Systems
    • Carriers and cassettes for moving silicon wafers
    • End-effectors for robotic arms
    • Load port components
  2. Process Chamber Parts
    • Gas distribution plates (“showerheads”)
    • Electrostatic chucks for wafer holding
    • Plasma-resistant liners and shields
    • Vacuum chamber components
  3. Testing Equipment
    • Probe cards for electrical testing
    • Alignment fixtures for optical inspection
    • Test sockets and interfaces
  4. Chemical Delivery Systems
    • Valve bodies and manifolds
    • Fluid distribution blocks
    • Precision nozzles and injectors

Why Precision Matters in Semiconductor Manufacturing

In semiconductor manufacturing, even the tiniest speck of dust can ruin an entire wafer of chips. That’s why precision isn’t just important—it’s absolutely necessary.

Our 5-axis machining capabilities let us create complex shapes with perfect accuracy. When making parts for plasma etch chambers, we need to achieve tolerances of ±0.001mm—that’s about 1/50th the width of a human hair! These tight tolerances ensure:

  • Perfect wafer alignment for nanoscale features
  • Consistent gas flow in process chambers
  • Reliable vacuum sealing to maintain ultra-pure environments
  • Precise electrical testing of completed chips

Our Advanced Manufacturing Processes

At Istar Machining, we use multiple advanced processes to create semiconductor components:

5-Axis CNC Milling

Our 5-axis machines can create complex 3D shapes in a single setup, maintaining tight tolerances throughout. This is perfect for making electrostatic chuck components that need perfectly flat surfaces with intricate cooling channels underneath.

EDM Wire Cutting

For extremely precise cuts in hard materials, we use EDM machining (Electrical Discharge Machining). This process can cut through materials like tungsten with accuracy down to 0.0001 inches.

Precision Turning

Our CNC turning services create perfectly cylindrical parts used in vacuum systems and gas delivery components.

Surface Grinding

When components need perfect flatness, our surface grinding services can achieve surface variations of less than 0.0001 inches across an entire part.

Quality Assurance for Semiconductor Components

Every semiconductor part we make goes through strict quality checks:

  • CMM measurement to verify all critical dimensions
  • Surface roughness testing to ensure mirror-like finishes
  • Particle detection to confirm cleanliness standards
  • Material certification to verify chemical composition
  • First Article Inspection for new part designs

Real-World Applications

Our semiconductor CNC machining work helps create:

  • Microprocessors for computers, phones, and servers
  • Memory chips for data storage devices
  • Sensor components for cameras, touchscreens, and IoT devices
  • RF chips for wireless communications
  • Power management ICs for efficient energy use

Technical Specifications

Parameter

Typical Specification

Our Capability

Tolerances

±0.001mm (0.00004″)

✓ Achieved with precision equipment

Surface Finish

Ra <0.2μm

✓ Mirror-like finishes standard

Cleanroom Standard

ISO Class 7

✓ Dedicated clean manufacturing area

Material Purity

Semiconductor grade

✓ Certified material sources

Lead Time (Prototypes)

5-15 days

✓ Quick-turn options available

Why Choose Istar Machining for Semiconductor Components?

When you work with Istar Machining for your semiconductor parts, you get:

  1. Industry Expertise – We understand the unique needs of semiconductor manufacturing
  2. Quality Assurance – ISO 9001 certified processes with full traceability
  3. Material Knowledge – Experience working with specialty materials for semiconductor applications
  4. Advanced Equipment – 5-axis CNC, EDM wire, and precision grinding capabilities
  5. Clean Processing – Dedicated facilities for particle-free manufacturing
  6. Quick Turnaround – Responsive service for time-critical projects
  7. Engineering Support – Help with material selection and design for manufacturability

Case Study: Plasma Chamber Components

A leading semiconductor equipment manufacturer needed custom gas distribution plates for their new etching system. These complex parts required:

  • Hundreds of precisely positioned holes
  • Mirror-like surface finish
  • Yttria coating for plasma resistance
  • Zero particle contamination

Our team used CNC milling to create the base shape, EDM for the precise hole pattern, and worked with specialized coating partners for the plasma-resistant finish. The final parts were delivered on time and performed flawlessly in the customer’s system.

Industries We Serve

While semiconductor is our specialty, our precision machining capabilities serve many high-tech fields:

Get Started With Your Semiconductor CNC Machining Project

Ready to discuss your semiconductor component needs? Contact Istar Machining today:

  1. Send us your CAD files for a quick quote
  2. Discuss your material requirements with our engineers
  3. Get a detailed timeline for production
  4. Receive precision-machined parts that meet all specifications

FAQ About Semiconductor CNC Machining

For vacuum applications, we typically recommend 316L stainless steel, aluminum 6061-T6, or specialty alloys like Kovar that have been properly cleaned and prepared for high-vacuum environments.

Our semiconductor components are processed in an ISO Class 7 cleanroom environment and undergo special cleaning steps to remove all traces of machining oils, particles, and contaminants.

Yes, we can machine base components from resistant materials like alumina ceramic, or apply specialized coatings like yttrium oxide (Y₂O₃) that withstand harsh plasma environments.

Prototype parts can be ready in 5-15 days depending on complexity. Production runs typically require 2-4 weeks, but we offer expedited services when needed.

Yes, we provide full material certifications and traceability documentation for all semiconductor components.

Please enable JavaScript in your browser to complete this form.